SPECIFICATIONS

–
Essentials
Status EOIS
Launch Date Q4’07
Processor Number E2200
# of Cores 2
Clock Speed 2.2 GHz
L2 Cache 1 MB
FSB Speed 800 MHz
FSB Parity No
Instruction Set 64-bit
Embedded Options Available

No
Lithography 65 nm
Max TDP 65 W
VID Voltage Range 0.8500V-1.5V
Recommended Customer Price N/A
–
Package Specifications
TCASE 73.3°C
Package Size 37.5mm x 37.5mm
Processing Die Size 77 mm2
# of Processing Die Transistors 105 million
Sockets Supported LGA775
Low Halogen Options Available See MDDS
–
Advanced Technologies
Intel® Turbo Boost Technology ‡ No
Intel® Hyper-Threading Technology ‡

No
Intel® Virtualization Technology (VT-x) ‡

No
Intel® Virtualization Technology for Directed I/O (VT-d) ‡

No
Intel® 64 ‡

Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology

Yes
Intel® Demand Based Switching

No
Thermal Monitoring Technologies Yes
–
Intel® Data Protection Technology
AES New Instructions

No
–
Intel® Platform Protection Technology
Trusted Execution Technology ‡

No
Execute Disable Bit ‡ Yes

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